吴考，男，香港大学博士，副教授，湖北省相关人才项目入选者。博士期间曾赴科威特大学与新西兰奥克兰大学交流学习。研究主要涉及多糖物理改性及变化规律、多糖基复合物的组装结构、亲疏水性和耐候性等方面。近几年，先后在Food Hydrocolloids, International Journal of Biological Macromolecules等国际知名SCI杂志上发表论文32篇（含2区以上论文19篇）。参编国际学术专著1本（《Physical Modifications of Starch》，施普林格出版社），并独立撰写其中1章（Microwave Treatment）。主持国家自然科学基金青年项目1项，纵向科研项目2项，参与国家自然科学基金项目3项。

代表性SCI论文 [1]Ying Fang, Weiling Wang, Hong Qian, Kao Wu*, Man Xiao, Xuewen Ni, Fatang Jiang, Sheng Chen*. (2020). Regular Film Property Changes of Konjac Glucomannan/Mung bean Starch Blend Films, Starch-Starke, accepted, [2]Kao Wu, Qian Zhu, Hong Qian, Man Xiao, Harold Corke, Katsuyoshi Nishinari, Fatang Jiang*. (2018) .Controllable hydrophilicity-hydrophobicity and related properties of konjac glucomannan and ethyl cellulose composite films, Food Hydrocolloids, 79, 301-309. [3]Kao Wu, Anil Gunaratne, Renyou Gan, Jinsong Bao, Harold Corke, Fatang Jiang*. (2018). Relationships between cooking properties and physicochemical properties in brown and white rice, Starch-Starke, 70(5-6), 1700167. [4]Kao Wu, Shuhong Dai, Renyou Gan, Harold Corke, Fan Zhu* (2016). Thermal and rheological properties of mung bean starch blends with potato, sweet potato, rice, and sorghum starches. Food and Bioprocess Technology, 9(8), 1408-1421. [5]Kao Wu, Renyou Gan, Shuhong Dai, Yizhong Cai, Harold Corke, Fan Zhu* (2016). Buckwheat and millet affect thermal, rheological, and gelling properties of wheat flour. Journal of Food Science, 81(3), E627-636. [6]K. Wu, P.W. Lucas, A. Gunaratne, L.S. Collado, H. Corke, A.S. Almusallam, L.A. Thai (2016). Indentation as a potential mechanical test for textural noodle quality. Journal of Food Engineering, 177, 42-49. [7]Kao Wu, A. Gunaratne, Lilia S. Collado, Peter W. Lucas, Harold Corke. (2015). Adhesion, cohesion and friction estimated from combining cutting and peeling test results for thin noodle sheets. Journal of Food Science, 80(2), E370-376. 编写国际学术专著信息 [1] Kao Wu (2018). Microwave Treatment. In Zhongquan Sui & Xiangli Kong (Eds.), Physical Modifications of Starch (pp. 97-117). Singapore: Springer Singapore.